LTCC Low Temperature Co-fired Ceramic
LTCC LAB offers design, prototype and manufacturing of LTCC (Low Temperature Co-fired Ceramic), multi-layer substrates, Screen Printing and packaging technology for a wide range of applications Multi-chip module, High-bandwidth and high-speed networks. One of the methods is designing and manufacturing products using Low-Temperature Cofired Ceramic (LTCC) technology.
Low Temperature Co-fired Ceramic (LTCC) materials systems offer the highest performance packaging solutions for high-frequency devices in a wide variety of applications in the telecommunication, microwave, automotive, professional electronics, LTCC Bluetooth, Antenna Module, Transmitter, Power Amplifier, Filter Component, Duplexer Switch, and other applications.
Advantages of LTCC (Low Temperature Cofired Ceramic) are Cost efficiency for high volumes, High packaging density, Reliability, embedded passives component (Capacitors Inductors and Resistors), Good Dielectric thickness control, high print resolution of conductors materials and low K dielectric material (7.8). LTCC LAB can Replace your PCB (FR4) material with high Tech LTCC substrates. Contact us for more information.
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