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LTCC LAB offers a whole new products design, prototype and manufacturing of LTCC, Low Temperature Co-fired Ceramics. Contact LTCC LAB with your design.

                      

  LTCC 90784 module                     LTCC 90587 Substrate

 

  BGA 80684 print in LTCC

LTCC LAB can Replace your PCB (FR4) material with high Tech LTCC  substrates. Contact us for more information.

LTCC- Low Temperature Co-fired Materials Properties

LTCC Dielectric Constant @1 MHz 7.8

DF (Dissipation Factor) @ 10 MHz 0.15%

I R (Insulation Resistance) @ 100 V DC > 1012  Meg ohms 

Ceramic Breakdown Voltage V/25m  > 1000V

LTCC Shrinkage  X, Y shrinkage (12.2%) and  Z (15%)

Thermal expansion of LTCC (25C-300C) 5.8ppm/C

Typical LTCC Via Diameter is 101m (4 mils) Via cap 9 mils

Line Width 6 mils, Line space 6 mils

Cofired Inner Layer Conductor 100% Silver (Ag).

Cofired Top Layer Conductor Pd/Ag, Solderable termination, or Gold.

go to: LTCC Design Rules

For information on LTCC Electrical and Mechanical properties go to LTCC Technical Information

 

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