LTCC LAB offers a whole new products design, prototype and manufacturing of LTCC, Low Temperature Co-fired Ceramics. Contact LTCC LAB with your design.
LTCC LAB can Replace your PCB (FR4) material with high Tech LTCC substrates. Contact us for more information.
LTCC- Low Temperature Co-fired Materials Properties
LTCC Dielectric Constant @1 MHz 7.8
DF (Dissipation Factor) @ 10 MHz 0.15%
I R (Insulation Resistance) @ 100 V DC > 1012 Meg ohms
Ceramic Breakdown Voltage V/25µm > 1000V
LTCC Shrinkage X, Y shrinkage (12.2%) and Z (15%)
Thermal expansion of LTCC (25°C-300°C) 5.8ppm/°C
Typical LTCC Via Diameter is 101µm (4 mils) Via cap 9 mils
Line Width 6 mils, Line space 6 mils
Cofired Inner Layer Conductor 100% Silver (Ag).
Cofired Top Layer Conductor Pd/Ag, Solderable termination, or Gold.
go to: LTCC Design Rules
For information on LTCC Electrical and Mechanical properties go to LTCC Technical Information
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