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LTCC- Low Temperature Co-fired Ceramic process and parameters (typical)

LTCC fired Dielectric Constant @ 3GHz   7.8

Loss Tangent @ 3 GHz  0.006

DF (Dissipation Factor) @ 10 MHz 0.15%

I R (Insulation Resistance) @ 100 V DC > 1012  Meg ohms 

Ceramic Breakdown Voltage V/25m  > 1000V

LTCC Shrinkage  X, Y 12.2%,  Z 15%

LTCC Thermal Conductivity  W/mk   3.3

Thermal expansion of LTCC (25C-300C) 5.8ppm/C

Young's modulus  GPa  120

Flexural Strength  MPa  320

LTCC Density  g/cm3  3.1

Surface Roughness m 3.3

Typical LTCC Via Diameter is 4 to10mils, Via cap 9 mils (Minimum).

Conductors Print, Line Width 6 mils, Line space 6 mils (Minimum).

Cofired Inner Layer Conductor 100% Silver (Ag).

Cofired Top Layer Conductor Pd/Ag, Solderable termination, or Gold.

LTCC Green and fired tape thickness.

Green tape Thickness Fired thickness
51m (2 mils) 1.7 mils
114m (4.5 mils) 3.8 mils
165m (6.5 mils) 5.5 mils
254m (10 mils)  8.5 mils

Typical Design Rules for LTCC. (LTCC LAB can change the Design rules to meet customer specifications)

4 mils Vias

 

LTCC Design rules 

Standard LTCC (in)

Option ltcc

Via Diameter

0.005

0.004" to 0.008"

Via Cover Pad

0.009

+0.004" Via Diameter

Via center to Center

0.012

 

Line Width

0.006

0.003" and up

Line to Line Spacing

0.006

0.003"

Via Center to LTCC Edge

0.014

 

Line to LTCC Edge

0.012

 

Planes Grid Line

0.006

 

Planes Line Spacing

0.012

0.010"

Planes to LTCC Edge

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