LTCC- Low Temperature Co-fired Ceramic process and parameters (typical)
LTCC fired Dielectric Constant @ 3GHz 7.8
Loss Tangent @ 3 GHz 0.006
DF (Dissipation Factor) @ 10 MHz 0.15%
I R (Insulation Resistance) @ 100 V DC > 1012 Meg ohms
Ceramic Breakdown Voltage V/25µm > 1000V
LTCC Shrinkage X, Y 12.2%, Z 15%
LTCC Thermal Conductivity W/mk 3.3
Thermal expansion of LTCC (25°C-300°C) 5.8ppm/°C
Young's modulus GPa 120
Flexural Strength MPa 320
LTCC Density g/cm3 3.1
Surface Roughness µm 3.3
Typical LTCC Via Diameter is 4 to10mils, Via cap 9 mils (Minimum).
Conductors Print, Line Width 6 mils, Line space 6 mils (Minimum).
Cofired Inner Layer Conductor 100% Silver (Ag).
Cofired Top Layer Conductor Pd/Ag, Solderable termination, or Gold.
LTCC Green and fired tape thickness.
Typical Design Rules for LTCC. (LTCC LAB can change the Design rules to meet customer specifications)
4 mils Vias
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