LTCC Low Temperature Co-fired Ceramic Design Rules

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LTCC Low Temperature Co-fired Ceramic

LTCC Design Rules

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Typical LTCC Design Rules for LTCC

Design rules	Standard (in)	Option
Via Diameter	0.005	0.004" to 0.008"
Via Cover Pad	0.009	+0.004" Via Diameter
Via center to Center	0.012
Line Width	0.006	0.003" and up
Line to Line Spacing	0.006	0.003"
Via Center to LTCC Edge	0.014
Line to LTCC Edge	0.012
Planes Grid Line	0.006
Planes Line Spacing	0.012	0.010"
Planes to LTCC Edge	contact LTCC LAB

LTCC Green and fired tape thickness.

Green tape Thickness	Fired thickness
51µm (2 mils)	1.7 mils
114µm (4.5 mils)	3.8 mils
165µm (6.5 mils)	5.5 mils
254µm (10 mils)	8.5 mils

LTCC- Low Temperature Co-fired Ceramic parameters

LTCC Dielectric Constant @1 MHz 7.8

DF (Dissipation Factor) @ 10 MHz 0.15%

I R (Insulation Resistance) @ 100 V DC > 1012 Meg ohms

Ceramic Breakdown Voltage V/25µm > 1000V

LTCC Shrinkage X, Y 12.2%, Z 15%

Thermal expansion of LTCC (25°C-300°C) 5.8ppm/°C

Typical LTCC Via Diameter is 101µm (4 mils) Via cap 9 mils

Line Width 6 mils, Line space 6 mils

Cofired Inner Layer Conductor 100% Silver (Ag).

Cofired Top Layer Conductor Pd/Ag, Solderable termination, or Gold.

LTCC green tape with 4 mils via (X200)

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TCC R1 - 6 mils Line and 6 mils space between the Lines.

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LTCC R2 - 12 mils Space Via to Line.

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LTCC R3 - Via to Line connection

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LTCC R4 - 12 mils Via pitch to Via pitch (4 mils vias)

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LTCC R5 - Planes, 6 mils Grid Line and 10 mils Space between the Line

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LTCC R6 - 12 mils (0.012") Space Line to ceramic Edge, 14 mils (0.014") Via pitch to ceramic Edge

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