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LTCC R4 - 12 mils Via pitch to Via pitch (4 mils vias)
Low Temperature Co-fired Ceramic (LTCC) materials systems offer the highest performance packaging solutions for high-frequency devices in a wide variety of applications in the telecommunication, microwave, automotive, professional electronics, LTCC Bluetooth, Antenna Module, Transmitter, Power Amplifier, Filter Component, Duplexer Switch, and other applications.
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