LTCC R6 - 12 mils (0.012") Space Line to ceramic Edge, 14 mils (0.014") Via pitch to ceramic Edge
LTCC Low Temperature Co-fired Ceramic
LTCC LAB offers a whole design, prototype and manufacturing of LTCC (Low Temperature Co-fired Ceramic), for a wide range of applications Multi-chip module, High-bandwidth and high-speed networks. One of the methods is designing and manufacturing products using Low-Temperature Cofired Ceramic (LTCC) technology.
Low Temperature Co-fired Ceramic (LTCC) materials systems offer the highest performance packaging solutions for high-frequency devices in a wide variety of applications.
Advantages of LTCC (Low Temperature Cofired Ceramic) are Cost efficiency for high volumes, High packaging density, Reliability, embedded passives component (Capacitors Inductors and Resistors).
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